[Tu-P] Poster Presentation

[Tu-P-09] A study of sublimation-controlled confinement etching of SiC as a CMP-free damage-less wafer manufacturing process

*Tadaaki Kaneko¹, Masatake Nagaya², Kazufumi Aoki¹, Daichi Doujima¹ (1. Kwansei Gakuin Univ(Japan), 2. DENSO CORPORATION(Japan))