ICSCRM2019

Presentation information

Oral Presentation

Packaging and Applications

[We-1B] High Temperature and IC

Wed. Oct 2, 2019 8:45 AM - 10:15 AM Annex Hall 2 (Kyoto International Conference Center)

9:30 AM - 9:45 AM

[We-1B-03] Experimental Study on Mitigation of Lifetime-Limiting Dielectric Cracking in Extreme Temperature 4H-SiC JFET Integrated Circuits

*David J Spry1, Philip G Neudeck1, Carl W Chang2 (1. NASA(United States of America), 2. Vantage Partners LLC(United States of America))