ICSCRM2019

講演情報

Oral Presentation

Packaging and Applications

[We-1B] High Temperature and IC

2019年10月2日(水) 08:45 〜 10:15 Annex Hall 2 (Kyoto International Conference Center)

09:30 〜 09:45

[We-1B-03] Experimental Study on Mitigation of Lifetime-Limiting Dielectric Cracking in Extreme Temperature 4H-SiC JFET Integrated Circuits

*David J Spry1, Philip G Neudeck1, Carl W Chang2 (1. NASA(United States of America), 2. Vantage Partners LLC(United States of America))