Oral Presentation

[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

Wed. Nov 27, 2019 5:00 PM - 6:30 PM Room 108 (1F)

Chair: Toshihide Kamata (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Makoto Arai (ULVAC Inc.)

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5:00 PM - 5:05 PM

[FLX1/FMC3-OP] Opening

5:05 PM - 5:30 PM

[FLX1/FMC3-1(Invited)] Printed Invisible Silver-Grid Transparent Electrode on Flexible Epoxy Film and Application to Powder Electroluminescent Device

*Masato Ohsawa¹, Natsuki Hashimoto¹, Naoki Takeda², Shota Tsuneyasu², Toshifumi Satoh² (1. ULVAC, Inc. (Japan), 2. Tokyo Polytechnic University (Japan))

5:30 PM - 5:50 PM

[FLX1/FMC3-2] Al alloying effect in functionalization of mechanical resistance to foldable display interconnections

*Chiharu Kura¹, Mototaka Ochi¹, Hiroyuki Okuno², Hiroshi Goto² (1. Kobe Steel, LTD. (Japan), 2. Kobelco Research Institute, Inc. (Japan))

5:50 PM - 6:05 PM

[FLX1/FMC3-5L] Roll-to-roll Processing of Transparent and Robust Permeation Barrier Films for Flexible Electronics

*John Fahlteich¹, Michiel Top¹, Stefan Hinze¹, Uwe Meyer¹, Tobias Vogt¹, Valentijn von Morgen², Matthias Fahland¹ (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))

6:10 PM - 6:30 PM

[FLX1/FMC3-4] Improvement of the Corrosion Resistance of TCO/Ag/TCO Structure for Transparent Conductive Layer

*Yuto Toshimori¹, Sohei Nonaka¹ (1. Mitsubishi Materials Corporation (Japan))

Sessions

Workshop on Flexible Electronics » [FLX1/FMC3] Advanced Materials and Components for Flexible Electronics