The 26th International Display Workshops (IDW '19)

講演情報

Oral Presentation

[FLX1/FMC3] Advanced Materials and Components for Flexible Electronics

2019年11月27日(水) 17:00 〜 18:30 Room 108 (1F)

Chair: Toshihide Kamata (National Institute of Advanced Industrial Science and Technology)
Co-Chair: Makoto Arai (ULVAC Inc.)

17:50 〜 18:05

[FLX1/FMC3-5L] Roll-to-roll Processing of Transparent and Robust Permeation Barrier Films for Flexible Electronics

*John Fahlteich1, Michiel Top1, Stefan Hinze1, Uwe Meyer1, Tobias Vogt1, Valentijn von Morgen2, Matthias Fahland1 (1. Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Germany), 2. DuPont Teijin Films Ltd. (UK))

キーワード:Permeation Barrier, Flexible Electronics Encapsulation, Magnetron Sputtering, PECVD, Roll-to-Roll

Water vapor permeability of permeation barrier films and thin film encapsulation coatings is determined both by intrinsic factors: material and technology selection and extrinsic factors: e.g. particle contamination or process defects. This paper discusses optimization strategies to achieve low permeability gas barrier films that are robust in roll-to-roll processing and integration to devices. Water vapor transmission rates of < 5·10-4 g/(m²d) at 38°C / 90 % r.h. are demonstrated reproducibly in a full roll-to-roll process chain using a sputtered barrier layer and a protective top-coat.