Mechanism of formation of fine solidified structure of lead-free solder by ultrasonic irradiation

Presentation information

Organized Sessions

High Temperature Processes

Thu. Sep 22, 2022 1:00 PM - 2:40 PM Room2 (Bldg. A 2nd fl. A28)

座長:奥村圭二 [名工大]

2:00 PM - 2:20 PM

^○Naoyuki Toriyama, Keiji Okumura (Nagoya Inst. of Tech.)

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