IVC-22

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Parallel Sessions

ISSP / Surface Engineering

[Thu-H1] ISSP / Surface Engineering

Thu. Sep 15, 2022 10:15 AM - 11:45 AM Room H (Meeting Room 204)

11:15 AM - 11:30 AM

[Thu-H1-4] Diffusion barrier properties of cosputtered W–Si–N films

Yung-I Chen1, *Kuo-Hong Yeh1, Tzu-Yu Ou2, Li-Chun Chang2 (1. National Taiwan Ocean University (Taiwan), 2. Ming Chi University of Technology (Taiwan))

Keywords:Diffusion barrier, Sputtering, Annealing

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