[G] Solid process/ Solid and welding process(1)

[315] Power Cycle Endurance Analysis of die Attach in Power Device Joined by Pressure Sintering using Ag nanoparticles

*Kiichi NAGATA¹, Yoshiharu KARIYA², Akito NISHI³ (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology, 3. Assembly Development Department, Assembly Engineering Division, Engineering Headquarters, Sanken Electric)

Keywords:マイクロ接合、実装、パワーサイクル寿命

有限要素法解析を用いて，Agナノ粒子により焼結されたディスクリートパワーデバイスダイアタッチ接合部のパワーサイクル寿命におよぼす加圧焼結の影響を検討した．