日本金属学会2020年秋期(第167回)講演大会

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process(1)

Wed. Sep 16, 2020 1:00 PM - 3:50 PM Rm. O (ZoomRm.O)

Chair:Tatsuya Kobayashi Sub Chairman (assistant):Tatsuya Kobayashi

2:00 PM - 2:15 PM

[319] Crack Growth Behavior in Fatigue Crack Networks Formation of Die Attach Joint

*Hiroshige SUGIMOTO1, Yoshiharu KARIYA2, Yoshinori YOKOYAMA3, Ryuichiro HANADA3, Shinnosuke SODA3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:Fatigue crack network、Die attach、Lead-free solder、Power module

パワーモジュールダイアタッチの疲労き裂ネットワークの寿命予測方法を検討するため,接合体試験片を用いて温度サイクル試験を行い,疲労き裂ネットワークの発達過程をき裂長さとサイクル数の関係から精査した.

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