[G] Solid process/ Solid and welding process(1)

[321] Delamination Analysis of Insulation Interlayer Dielectric Film in Semiconductor Package Structure

*kenta ONO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology)

Keywords:Delamination、Energy release rate、Polymer、Semiconductor Package Structure、Finite element method

半導体用層間絶縁膜と配線材料界面の剥離評価を目的とし，有限要素法解析による配線構造内部の感光性樹脂 / Cu配線界面の剥離判定結果およびき裂進展経路の検討結果について講演する．