[G] Solid process/ Solid and welding process(1)

[323] Fatigue Life Prediction Method of BGA Package Solder Joint Under Combined Thermal and Vibration Loading Including the Microstructural Coarsening

*Kouichi MOROOKA¹, Yoshibaru KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Material Science and Engineering Department Shibaura Institute of Technology)

Keywords:Solder joint、Thermal fatigue、Vibration fatigue、Microstructural coarsening、Finite element method

本研究ではBGAパッケージはんだ接合部の組織変化を考慮した熱振動複合負荷における疲労寿命予測を目的とする．講演では理論的アプローチによるFEM解析を用いた疲労寿命予測手法の提案および予測結果を発表する．