[G] Packaging

[258] Effects of Structural Factors on Stress State of Die Attach Joint in Power Semiconductor Device During Power Cycling

*Yuya CHISHIMA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

Keywords:Power semiconductor device、Die attach joint、Power cycling、Finite element analysis

電力半導体モジュールに対して構造因子および通電プロファイルに着目し，有限要素法を用いた因子解析を行い，ダイアタッチ接合部の応力状態を調査した．