一般講演

[G] Powder sintering and additive manufacturing

Thu. Sep 16, 2021 9:00 AM - 11:30 AM Rm. K (ZoomRm.K)

Chair:Shinya Hibino

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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9:00 AM - 9:15 AM

[222] Microstructure control of SUS316L stainless steel by heterogeneous solidification in selective laser melting

*Satoshi Okubo¹, Kengo Fujimaki¹, Tomoki Yuasa², Hisashi Sato³, Yoshimi Watanabe³ (1. Tokyo Metropolitan Industrial Technology Research Institute, 2. Nagoya Institute of Technology (Present: Toyota Boshoku Corp.), 3. Nagoya Institute of Technology)

9:15 AM - 9:30 AM

[223] Microstructural control of a SKD61 tool steel fabricated by selective laser melting

*Hajime MIYAUCHI^1,2, Hiroaki Matsumoto³, Kozo Yokota¹ (1. Kagawa Prefectural Industrial Technology Center, 2. Kagawa University, 3. Kagawa University)

9:30 AM - 9:45 AM

[224] Influence of copper substrate on rapid solidification processing of copper powder by laser irradiation

*Yusuke Kamefuchi¹, Kohei Morishita¹, Hirofumi Miyahara¹ (1. Kyushu Univ.)

9:45 AM - 10:00 AM

[225] Effect of hatch distance on relative density and microstructure of laser powder bed fused Al-Si alloy

*Mai KUNIEDA¹, Tatsuya MIYASAKA³, Asuka SUZUKI², Naoki TAKATA², Makoto KOBASHI², Masaki KATO⁴ (1. Nagoya University, 2. Nagoya University, 3. Nagoya University（BROTHER INDUSTRIES, LTD.）, 4. Aichi Center for Industry and Science Technology)

break （10:00 AM - 10:30 AM）

10:30 AM - 10:45 AM

[226] Improvement in hardness and plastic anisotropy of Zn by sintering using ultra fine particles

*Kohei Nagayama¹, Shintaro Torii², Takahiro Mineta¹, Hiroyuki Sato¹ (1. Grad. School of Science and Technology Hirosaki Univ., 2. Grad. School of Science and Technology Hirosaki Univ.(Present: DOWA HOLDINGS CO., LTD))

10:45 AM - 11:00 AM

[227] Effect of microstructure on high temperature strength of additive manufactured Ni-base superalloy

*Masaki TANEIKE¹, Daichi AKAMA¹, Yasunari TAKEDA¹, Shuji TANIGAWA¹, Norihiko MOTOYAMA², Masahito KATAOKA² (1. Mitsubishi Heavy Industries,Ltd., 2. Mitsubishi Power, Ltd.)

11:00 AM - 11:15 AM

[228] Mechanical Surface Treatments on Inconel 718 Powders for Controlling the Powder Bed Charging in PBF-EB

*Fangzhou Liu¹, Kenta Aoyagi², Keiji Yanagihara², Keisuke Ito³, Akihiko Chiba² (1. Graduate School of Engineering, Tohoku University, 2. Institute for Materials Research, Tohoku University, 3. Miyagi Prefectural Government)

11:15 AM - 11:30 AM

[229] The effect of mechanical ball milling on electrical and powder bed properties of gas atomized Ti–48Al–2Cr–2Nb for suppressing smoke in EBM-AM process

*SEUNGKYUN YIM¹, Huakang Bian², Kenta Aoyagi², Kenta Yamanaka², Akihiko Chiba² (1. Graduate School of Engineering, Tohoku University, 2. Institute for Materials Research, Tohoku University)

一般講演

[G] Dissimilar and similar material joining

Thu. Sep 16, 2021 1:00 PM - 5:00 PM Rm. K (ZoomRm.K)

座長:芹澤久(大阪大学)、袴田昌高(京都大学)、伊藤和博(大阪大学)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:00 PM - 1:15 PM

[230] Microstructure and Mechanical Properties of A6061/GA980 Friction Stir Spot Weld

*Tsuyoshi Kosaka¹, Koki Kumamoto², Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, Gunma Univ., 2. Graduate School of Science and Technology, Gunma Univ. (SUBARU Co.）)

1:15 PM - 1:30 PM

[231] Microstructure investigation of weld interface by friction stir lap welding between A6061 and SPC270

*Yuheng LIU¹, Ayaka SATO¹, Toshiaki YASUI¹, Shuhei YAMAGUCHI², Hirofumi KOIKE², Katashi HIROSAWA³ (1. Toyohashi Univ. of Technology, 2. AISIN Corporation, 3. OSG Corporation)

1:30 PM - 1:45 PM

[232] Evaluation of interfacial strength of galvannealed steel/A6061 dissimilar joint prepared by friction stir spot welding using microscale tensile test

*Tomoki MATSUDA¹, Toshiya OGAKI¹, Mitsuru OHATA¹, Akio HIROSE¹ (1. 阪大工)

1:45 PM - 2:00 PM

[233] Microstructure and Bonding Strength of GA steel/Al alloy Laser Welded Joint

*Kosaku NAKAYAMA¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Tatsunori Matsunaga² (1. Graduate School of Science and Technology, Gunma Univ., 2. SUBARU Co.)

break （2:00 PM - 2:30 PM）

2:30 PM - 2:45 PM

[234] Joining CFRTP to Stainless Steel by Three-Dimensional Ni-Cu Electrodeposited Film

*Kohei YAMAZAKI¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology)

2:45 PM - 3:00 PM

[235] Research on Tensile Shear Strength of Advanced Multi-Material Dissimilar Lap Joint

*Hisashi SERIZAWA¹, Kotaro INOSE², Ryoji OHASHI³, Yukihiro SUGIMOTO⁴, Tadashi MINODA⁵, Toshio MURAKAMI⁶ (1. Osaka Univ., 2. IHI, 3. KHI, 4. Hiroshima Univ., 5. UACJ, 6. KOBELCO)

3:00 PM - 3:15 PM

[236] Two-step bonding of Nb-interlayer inserted Ti-6Al-4V/Si₃N₄ joint via transient liquid phase bonding and brazing

*FEI　SHEN ONG^1,2, RYOTARO NISHI^1,2, HIROBUMI TOBE², EIICHI SATO² (1. Univ. of Tokyo、2. Inst. of Space and Astronautical Science (ISAS/JAXA))

3:15 PM - 3:30 PM

[237] Effect of pressure on bonding surface on Transient Liquid Phase Bonded Ti-6Al-4V similar joint with Cu-Ni multi Fillers

*Ryotaro Nishi^1,2, Fei　Shen Ong^1,2, Hirobumi Tobe², Eichi Sato² (1. U-tokyo, 2. ISAS/JAXA)

break （3:30 PM - 4:00 PM）

4:00 PM - 4:15 PM

[238] Pressure-controlled joule-heat forge welding of medium carbon steel by utilizing tapered specimen

*Huihong LIU¹, Tetsuya MIYAGAKI¹, Masayoshi KAMAI¹, Yunwu MA¹, Ninshu MA¹, Hidetoshi FUJII¹ (1. JWRI, Osaka Univ.)

4:15 PM - 4:30 PM

[239] Microstructural Change of Plated Layer in Al Plated Steel Sheet in Hot-Stamping Process

*Kyohei KAMIYA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Hiroaki MIYANAGA² (1. Graduate School of Science and Technology, Gunma Univ., 2. TOA Industries Co., Ltd.)

4:30 PM - 4:45 PM

[240] Fluxless Liquid Phase Diffusion Bonding of Aluminum Alloy.

*Tomoyuki TAKAHASHI¹, Shinji KOYAMA¹, Masatoshi ITO², Hayato ASANO² (1. Gunma Univ., 2. DAIKIN INDUSTRIES, LTD.)

4:45 PM - 5:00 PM

[241] Electrodeposition joining of aluminum alloys

*Masataka HAKAMADA¹, Soya HIROSE², Yuki YAMAMOTO¹, Mamoru MABUCHI¹ (1. Graduate School of Energy Science, Kyoto Univ., 2. Graduate School of Energy Science, Kyoto Univ. (Present: Lasertec Co.))

一般講演

[G] Joining, adhesive joining, welding and packaging

Fri. Sep 17, 2021 9:00 AM - 11:30 AM Rm. K (ZoomRm.K)

座長:宮澤靖幸(東海大学)、伊藤和博(大阪大学)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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9:00 AM - 9:15 AM

[242] Stress Evaluation during Cure Process of Ultraviolet Curable Adhesive

*Takahiro KODERA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and EngineeringShibaura Institute of Technology)

9:15 AM - 9:30 AM

[243] Evaluation of seizure behavior on Cr plating treatment of
austenitic stainless steel by high temperature friction test

*Kaoru TAKEUCHI¹, Yoshietsu OHTA², Yen-Ling KUO¹, Makoto NANKO¹ (1. Nagaoka University of Technology, 2. Johetsu Industry Co.)

9:30 AM - 9:45 AM

[244] Corrosion Behavior of Brazed Joint Using Electroplated Ni-P-Cr Alloy Coating

*Yuya MATSUO¹, Shubin LIU¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Junichiro HIROHASHI², Tsunehito WAKI², Hiroki YAMAMOTO³ (1. Graduate School of Science and Technology, Gunma Univ., 2. Waki Factory Inc., 3. Kandori Industry)

9:45 AM - 10:00 AM

[245] TIG welding of Al/Cu dissimilar thin plates using a constricted nozzle

*Hajime Yamamoto¹, Kazuhiro Ito¹, Makoto Takahashi¹, Manabu Tanaka¹, Anh　Van Nguyen², Akihisa Murata² (1. JWRI, Osaka Univ., 2. Murata Welding Laboratories Co. Ltd.)

break （10:00 AM - 10:30 AM）

10:30 AM - 10:45 AM

[246] Microstructures and mechanical properties of electrodeposited copper joint

*Shinji FUKUMOTO¹, Koki NAKAMURA¹, Michiya MATSUSHIMA¹ (1. Graduate School of Engineering, Osaka Univ.)

10:45 AM - 11:00 AM

[247] Analysis of Molten Metal Behavior using In-Situ Observation process

*Hikaru TAJIMA¹, Kazuhiro YOSHIDA¹, Yasuyuki MIYAZAWA¹, Hidenobu TAMEDA², Kyohei FURIHATA² (1. Tokai Univ, 2. KITZ METALWORKS CORPORATION)

11:00 AM - 11:15 AM

[248] Fabrication and Evaluation of Lead-Free Solders Containing Cellulose Nanofibers by Composite Plating

*Ayuki KOGURE¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology, Gunma Univ.)

11:15 AM - 11:30 AM

[249] Effects of Current Density and Current Charge Density on Codeposition Morphology of Cellulose Nano-Fiber Composited Nickel Electroplating Films

*Makoto Iioka¹, Wataru Kawanabe², Shohji Ikuo¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, 2. School of Science and Technology)

一般講演

[G] Packaging

Fri. Sep 17, 2021 1:00 PM - 5:00 PM Rm. K (ZoomRm.K)

Chair:Hajime Yamamoto(JWRI), Shinji Fukumoto(Osaka University)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:00 PM - 1:15 PM

[250] Interfacial Crack Growth Rate Measurement of Interlayer Dielectric Film on Cu for Redistribution Layer of Semiconductor Package

*Kaiwen ZHONG¹, Yoshiharu KARIYA² (1. Graduate University of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

1:15 PM - 1:30 PM

[251] Thermal Fatigue Fracture of Sn-3.0Ag-0.5Cu Solder under Equi-Biaxial Stress

*Yoshiki ABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

1:30 PM - 1:45 PM

[252] Elastic-Plastic-Creep Simulation of sintered Ag nanoparticles by Separation of Plastic and Creep

*Masahiro URABE¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

1:45 PM - 2:00 PM

[253] Effect of Microstructure on Fatigue Crack Propagation Properties of Ag Sintered body

*Sho ISHIHARA¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

break （2:00 PM - 2:30 PM）

2:30 PM - 2:45 PM

[254] Effect of Ni Addition on Fatigue Properties of Sn-Sb-Ag-Ni-Ge Solder Alloy

*mizuki yamamoto¹, ikuo shohji¹, tatsuya kobayashi¹, kohei mitsui², hirohiko watanabe^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)

2:45 PM - 3:00 PM

[255] Power Cycle Damage Behavior of Sn-Sb-Ag-Ni-Ge Solder Joints

*Yuta YAMANAKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Kohei MITSUI², Hirohiko WATANABE^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electronic Co., Ltd.)

3:00 PM - 3:15 PM

[256] Effect of Bi and Sb Edition on Creep and Thermal Fatigue Life of Sn-Ag-Cu Solder Alloy

*Masaki MORIUCHI¹, Yoshiharu KARIYA² (1. Graduate Science and Engineering Department, 2. Material Science and Engineering Department Shibaura Institute of Technology)

3:15 PM - 3:30 PM

[257] Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn-58Bi Solder

*kazumi watarai¹, Ikuo shohji¹, Tatsuya Kobayashi¹, Tomohisa Hoshino², Kenichi Sato², Shunsuke Kobayashi², Naohito Odani² (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd.)

break （3:30 PM - 4:00 PM）

4:00 PM - 4:15 PM

[258] Effects of Structural Factors on Stress State of Die Attach Joint in Power Semiconductor Device During Power Cycling

*Yuya CHISHIMA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

4:15 PM - 4:30 PM

[259] Delamination Analysis of Stacked Via in High-Density-Multilayer Printed Wiring Boards by FEA

*Moe NOZAKI¹, Yoshiharu KARIYA², Yoshiyuki HIROSHIMA³, Nobuo TAKETOMI³, Kenichi OHASHI⁴, Kenichi TOMIOKA⁴, Shunichi KIKUCHI⁵, Jack TAN⁵ (1. Graduate school of Shibaura Institute of Technology, 2. Department of Material Science and Engineering, Shibaura Institute of Technology, 3. NTT Electronics Cross Technology Corp., 4. Showa Denko Materials Co., Ltd, 5. HDP User Group, Inc)

4:30 PM - 4:45 PM

[260] Evaluation of Fatigue Crack Propagation Characteristics at the Interface between Si Die and Underfill in Real Semiconductor Package Structure

*Hidetoshi HARA¹, Yoshiaharu KARIYA², Takayuki FUJITA³, Toshiaki ENOMOTO³, Hiroshi YAMAGUCHI³, Takuya YOSHIDA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

4:45 PM - 5:00 PM

[261] Reproduction Analysis of Fatigue Crack Networks in Die Attach Joint by FEA

*Hiroki KANAI¹, Yoshiharu KARIYA², Yoshiki ABE¹, Yoshinori YOKOYAMA³, Koki OCHI³, Ryuichiro HANADA³, Shinichi IZUO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Sessions

6.Materials Processing » Solid process/ Solid and welding process

[G] Powder sintering and additive manufacturing

[G] Dissimilar and similar material joining

[G] Joining, adhesive joining, welding and packaging

[G] Packaging

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