[G] Packaging

[251] Thermal Fatigue Fracture of Sn-3.0Ag-0.5Cu Solder under Equi-Biaxial Stress

*Yoshiki ABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Fatigue crack network、Equi-biaxial stress、Thermal fatigue fracture

はんだ合金の等2軸応力熱疲労試験方法を提案し，等2軸応力下におけるはんだ合金の疲労破壊挙動を調査した．