[G] Packaging

[261] Reproduction Analysis of Fatigue Crack Networks in Die Attach Joint by FEA

*Hiroki KANAI¹, Yoshiharu KARIYA², Yoshiki ABE¹, Yoshinori YOKOYAMA³, Koki OCHI³, Ryuichiro HANADA³, Shinichi IZUO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:Power module、Die attach joint、Life prediction、Thermal fatigue crack network、Finite element analysis

有限要素法解析を用いて疲労き裂ネットワークの再現解析を行い，実験結果およびFEM解析結果をき裂長さとサイクル数の観点から精査した．