Session information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Packaging Mechanics and other processes

Thu. Sep 22, 2022 12:30 PM - 3:45 PM Rm. P (C33,3Flr. Build.C)

Chair:Minho O(Tokyo Institute of Technology)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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12:30 PM - 12:45 PM

[344] Effect of Microstructure on Static Mechanical Properties of Ag Sintered Body

*Tatsuki OTANI¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology., 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)

12:45 PM - 1:00 PM

[345] Effect of Ga and Bi Addition on Thermal Fatigue Properties of Sn

*Naoyuki HAMADA¹ (1. Osaka Research Institute of Industrial Science and Technology)

1:00 PM - 1:15 PM

[346] Effect of Breakaway Stress on Creep and Thermal Fatigue Life of Sn-Ag-Cu Containing Solid Solution Elements

*Shin ONDA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

break (1:15 PM - 1:30 PM)

1:30 PM - 1:45 PM

[347] Strength Analysis of Micro Adhesive Joints by Fracture Mechanics Approach

*kouki KIMURA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

1:45 PM - 2:00 PM

[348] Fatigue Crack Propagation Testing of Sn-3.0Ag-0.5Cu / Cu Joints Using Miniature CT Specimens

*Toshiyuki MISU¹, Yoshiharu KARIYA², Hiroki KANAI¹ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

2:00 PM - 2:15 PM

[349] Evaluation Method of Adhesive Fracture Energy of Interlayer Dielectric Film on Cu for Redistribution Layer of Semiconductor Package by　Shear Test

*Hironao KAWABE¹, Yoshiharu KARIYA², Makoto HARAGUCHI³, Taku OGAWA³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

2:15 PM - 2:30 PM

[350] Reproduction Analysis of Stress State of Die Attach Joints in Power Semiconductor Modules during Power Cycling

*Misaki WATANABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

break (2:30 PM - 2:45 PM)

2:45 PM - 3:00 PM

[351] Fabrication of Ni-CNF Composite Plated Film by Electroless Plating Method

*Wataru KAWANABE¹, Makoto IIOKA¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Graduate School of Science and Technology Gunma University)

3:00 PM - 3:15 PM

[352] Study on Contact Resistance between Cu Wiring and Shield Film for Shield Packages

*Soichi Homma^1,2, Yuusuke Takano¹, Yusuke Akada¹, Takeshi Watanabe¹, Masatoshi Fukuda¹, Takashi Imoto¹, Hiroshi Nishikawa³ (1. Kioxia Corp., 2. Osaka Univ. Graduate School of Engineering, 3. Osaka Univ. Joining and Welding Research Institute)

3:15 PM - 3:30 PM

[353] Released Gas Analysis from Gold Leaf at Bonding Process on Traditional Craft KIRIKANE

*Osamu OHASHI¹, Takashi Harumoto², Takao Fukudome³, Azusa Kubota³, Hiroshi Onodera³, Takashi Kimura⁴, Kensau Aihara⁵, Hidetoshi Namiki⁵ (1. WELLBOND, 2. Tokyo Institute Technology, 3. JEOL, 4. NIMS(JEOL), 5. Tokyo Univ. of Arts)

3:30 PM - 3:45 PM

[354] Cutting temperature, cutting behavior and surface integrity of 0.45% carbon steel under high-speed machining

*Hyung-Won PARK¹, Masaki MATSUDA¹, Kanji ISHITAKA¹, Shinichi HUNASE¹, Atsushi TOMIZAWA¹, Jun YANAGIMOTO², Takashi UEDA³ (1. Komatsu University, 2. The University of Tokyo, 3. Kanazawa University)

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