Investigation of Formation Mechanism of Three-Dimensional Structure Ni-Cu Alloy Plating

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一般講演

6.Materials Processing » Solid process/ Solid and welding process

Thu. Sep 22, 2022 9:00 AM - 11:15 AM Rm. P (C33,3Flr. Build.C)

Chair:Equo KOBAYASHI(Tokyo Inst. of Tech.)

10:15 AM - 10:30 AM

*Thai　Anh PHAM¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Gunma Univ.)

Keywords:Ni-Cu Alloy、Electroplating、Dealloying、Microstructure

本研究では, 電気化学測定器を用いて, 三次元構造Ni-Cu合金めっき膜の生成メカニズムを調査する.

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