[G] Packaging Mechanics and other processes

[346] Effect of Breakaway Stress on Creep and Thermal Fatigue Life of Sn-Ag-Cu Containing Solid Solution Elements

*Shin ONDA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology)

Keywords:Thermal fatigue life prediction、Creep、BGA solder joint、Finite element method

Breakaway応力が異なる固溶元素を添加した合金のクリープ変形機構を理論的に予測し、その熱疲労寿命への影響について精査した。