[G] Solid state bonding/ Dissimilar material joining/ Welding process

Thu. Sep 19, 2024 1:00 PM - 2:45 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:(Tohoku University), (Tohoku University), (Toyohashi University of Technology)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:00 PM - 1:15 PM

[366] Simulation for Three-ply Resistance Spot Welding of High Tensile Strength Steel by Finite Element Method

*KENTA KAWAGUCHI¹, Toshiki Nonomura², Tatsuya Kobayashi¹, Ikuo Shohji¹, Hiroaki Miyanaga³ (1. Graduate School of Science and Technology, Gunma Univ., 2. Graduate School of Science and Technology, Gunma Univ. (currently JATCO Co., Ltd), 3. TOA INDUSTRIES)

1:15 PM - 1:30 PM

[367] Effects of furnace brazing of stainless steel with copper paste

*Ken Matsumura¹, Masahiro Nakahara¹, Hiroshi Ohshita² (1. Toyo Aluminium K.K., 2. KANTO YAKIN KOGYOCO., LTD.,)

1:30 PM - 1:45 PM

[368] Study on the Development of Detachable Dissimilar Material Joining Technology Using A1050 Alloy/C1020 Dissimilar Joint

*Tomo OGURA¹, Hiroki Nakashima², Kazuma Shimizu¹, Akio Hirose¹, Kenichi Yaguchi³, Ryo Muranaka³ (1. Grad. Sch. of Eng., Osaka Univ., 2. Grad. Sch. of Eng., Osaka Univ.1(Present: Nissan Motor Corporation), 3. Mitsubishi Materials Innovation Center)

1:45 PM - 2:00 PM

[369] Effect of Bonding Temperature on Progress of Anodic Bonding

*MAKOTO TAKAHASHI¹ (1. 阪大接合研)

2:00 PM - 2:15 PM

[370] Controlling the diffusion behavior in diffusion bonded Co-free Cr_0.8FeMn_1.3Ni_1.3 HEA/316SS joints by dislocations

*Haotian SUN¹, Naoyuki Hashimoto², Hiroshi Oka², Shigehito Isobe² (1. Graduate School of Engineering, Hokkaido Univ., 2. Faculty of Engineering, Hokkaido Univ.)

2:15 PM - 2:30 PM

[371] Microstructural stability and mechanical properties of diffusion bonded Cr_0.8FeMn_xNi_yMEA / F82H joint fabricated by SPS

*Qingyan XUE¹, 直幸橋本², 礒部礒部³, 弘岡⁴ (1. Hokkaido University、2. Hokkaido University、3. Hokkaido University、4. Hokkaido University)

2:30 PM - 2:45 PM

[372] Estimation of punching clearance by EBSD in electrical steels

Kyohei Hayakawa¹, *Takumi Hamaguchi¹, Isao Matsui¹ (1. Mitsubishi Heavy Ind.)

Session information

[G] Solid state bonding/ Dissimilar material joining/ Welding process

[366] Simulation for Three-ply Resistance Spot Welding of High Tensile Strength Steel by Finite Element Method

[367] Effects of furnace brazing of stainless steel with copper paste

[368] Study on the Development of Detachable Dissimilar Material Joining Technology Using A1050 Alloy/C1020 Dissimilar Joint

[369] Effect of Bonding Temperature on Progress of Anodic Bonding

[370] Controlling the diffusion behavior in diffusion bonded Co-free Cr_0.8FeMn_1.3Ni_1.3 HEA/316SS joints by dislocations

[371] Microstructural stability and mechanical properties of diffusion bonded Cr_0.8FeMn_xNi_yMEA / F82H joint fabricated by SPS

[372] Estimation of punching clearance by EBSD in electrical steels

Authentication

Session information

[G] Solid state bonding/ Dissimilar material joining/ Welding process

[366] Simulation for Three-ply Resistance Spot Welding of High Tensile Strength Steel by Finite Element Method

[367] Effects of furnace brazing of stainless steel with copper paste

[368] Study on the Development of Detachable Dissimilar Material Joining Technology Using A1050 Alloy/C1020 Dissimilar Joint

[369] Effect of Bonding Temperature on Progress of Anodic Bonding

[370] Controlling the diffusion behavior in diffusion bonded Co-free Cr0.8FeMn1.3Ni1.3 HEA/316SS joints by dislocations

[371] Microstructural stability and mechanical properties of diffusion bonded Cr0.8FeMnxNiy MEA / F82H joint fabricated by SPS

[372] Estimation of punching clearance by EBSD in electrical steels

Authentication

[370] Controlling the diffusion behavior in diffusion bonded Co-free Cr_0.8FeMn_1.3Ni_1.3 HEA/316SS joints by dislocations

[371] Microstructural stability and mechanical properties of diffusion bonded Cr_0.8FeMn_xNi_yMEA / F82H joint fabricated by SPS