[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

9:00 AM - 9:15 AM

[383] Delamination Analysis at the Dielectric Film / Redistribution Layer Interface in Semiconductor Package Structure using Cohesive Zone Model

*Yusei HAMADA¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

9:15 AM - 9:30 AM

[384] Computation of Delamination Toughness of Interlayer Dielectrics / Cu Interface for Semiconductor Pakage Redistribution Layer by Shear Testing

*Kourin YOSHIMOTO¹, Yoshiharu KARIYA², Mitsuka ANDO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

9:30 AM - 9:45 AM

[385] Effect of Initial Defect on Fatigue Crack Initiation Life of Sintered Ag Nanoparticles under Equibiaxial Thermal Stress

*Rion ISHII¹, Yoshiharu KARIYA², Koji SASAKI³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)

9:45 AM - 10:00 AM

[386] Thermal aging dependent nanoscale porous of pressured sinter silver determining heat transfer and strength properties for power electronics

*Ha-Young Yu¹, YehRi Kim¹, SeungYeon Han¹, Min-Su Kim¹, Dongjin Kim¹ (1. Korea Institute of Industrial Technology)

break (10:00 AM - 10:15 AM)

10:15 AM - 10:30 AM

[387] Comparison of Sn-Bi Lead-Free Solder for Flip Chip Bonding with Sn-3.0Ag-0.5Cu in Fatigue Properties

*Shota Umeda¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Hirokazu Noma², Kazue Hirano², Hitoshi Onozeki², Sadaaki Katoh² (1. Graduate School of Science and Technology, Gunma Univ, 2. Resonac)

10:30 AM - 10:45 AM

[388] Interfacial Reaction between Probe for Semiconductor Packages Inspection and Sn Solder

*Rin HASHIZUME¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Tomohisa Hoshino², Kenichi Sato², Shunsuke Kobayashi², Naohito Odani² (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd)

10:45 AM - 11:00 AM

[389] Material Factor on Delamination Driving Force for Interlayer Dielectric Film / Distribution Material Interface in Redistribution Layer of Semiconductor Package

*Daisuke ANDO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

11:00 AM - 11:15 AM

[390] Fabrication and Characterization of Joining Materials Using Al Powder

*Rika GOTO¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹ (1. Gunma University)

11:15 AM - 11:30 AM

[391] Evaluation of Thermal Fatigue Behavior of Lead-Free Solder Joints for Wafer-Level CSP

*Shun Sakagami¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Fumiya Funatomi², Kyohei Ohashi², Ryuki Sakai² (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)

11:30 AM - 11:45 AM

[392] Effect of Additional Elements on the Superplastic Deformation of Sn-Bi Alloys

*Akira YAMAUCHI¹, Masashi KUROSE¹ (1. National Institute of Technology, Gunma College)

Session information

[G] Solid process/ Solid and welding process