[G] Implementation / Mounting / BrazingAdhesion / Bonding/

Fri. Sep 20, 2024 1:00 PM - 3:00 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:(Osaka University), Shinji Fukumoto, (Gunma University), (Osaka University)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

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1:00 PM - 1:15 PM

[393] Effect of Static Strength on High Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

*Daigo YAMAZAKI¹, Yoshiharu KARIYA², Ryota KAMEKURA¹ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

1:15 PM - 1:30 PM

[394] Effect of Ag Addition on Crack Propagation Behavior of Sn-Sb-Ag-Ni-Ge Solder Alloy

*Kentaro Kawai¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Kohei Mitsui², Hirohiko Watanabe^1,2 (1. Gunma Univ., 2. FUJI ELECTRIC)

1:30 PM - 1:45 PM

[395] Evaluation of Solder Joint Properties of Ni-Cu Alloy Plating Films Formed by Electrochemical Methods

*Sota Mori¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, Gunma Univ.)

break (1:45 PM - 2:00 PM)

2:00 PM - 2:15 PM

[396] Analysis and Evaluation of Adhesive Deterioration between Epoxy Resin and Metal under High Humidity and High Temperature Environments

*Ryota Nakagawa¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Fumiya Funatomi², Kyohei Ohashi², Ryuki Sakai² (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)

2:15 PM - 2:30 PM

[397] Effect of Durability Improvement of Steel Sheets Adhesive Joints
by Plasma Polymer Coating Treatment

*Taro Katayama¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Ayaka Honda², Yugo Tomita² (1. Graduate School of Science and Technology Gunma Univ., 2. SUBARU)

2:30 PM - 2:45 PM

[398] Relaxation Behavior during Dark Reaction of Ultraviolet Curable Adhesive

*Naoki OTANI¹, KARIYA Yoshiharu², OGURI Takumi¹ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

2:45 PM - 3:00 PM

[399] Investigation of Degradation Behaviour of Adhesion between Copper and Molding　Resin for Power Module under High Temperature Environment

*Anzu Tozaki¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Hiroto Takenaka², Hirose Suzuki², Minoru Ueshima² (1. Graduate School of Science and Technology, Gunma Univ., 2. DAICEL)

Session information

[G] Implementation / Mounting / BrazingAdhesion / Bonding/

[393] Effect of Static Strength on High Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

[394] Effect of Ag Addition on Crack Propagation Behavior of Sn-Sb-Ag-Ni-Ge Solder Alloy

[395] Evaluation of Solder Joint Properties of Ni-Cu Alloy Plating Films Formed by Electrochemical Methods

[396] Analysis and Evaluation of Adhesive Deterioration between Epoxy Resin and Metal under High Humidity and High Temperature Environments

[397] Effect of Durability Improvement of Steel Sheets Adhesive Joints
by Plasma Polymer Coating Treatment

[398] Relaxation Behavior during Dark Reaction of Ultraviolet Curable Adhesive

[399] Investigation of Degradation Behaviour of Adhesion between Copper and Molding　Resin for Power Module under High Temperature Environment

Authentication

Session information

[G] Implementation / Mounting / BrazingAdhesion / Bonding/

[393] Effect of Static Strength on High Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

[394] Effect of Ag Addition on Crack Propagation Behavior of Sn-Sb-Ag-Ni-Ge Solder Alloy

[395] Evaluation of Solder Joint Properties of Ni-Cu Alloy Plating Films Formed by Electrochemical Methods

[396] Analysis and Evaluation of Adhesive Deterioration between Epoxy Resin and Metal under High Humidity and High Temperature Environments

[397] Effect of Durability Improvement of Steel Sheets Adhesive Jointsby Plasma Polymer Coating Treatment

[398] Relaxation Behavior during Dark Reaction of Ultraviolet Curable Adhesive

[399] Investigation of Degradation Behaviour of Adhesion between Copper and Molding Resin for Power Module under High Temperature Environment

Authentication

[397] Effect of Durability Improvement of Steel Sheets Adhesive Joints
by Plasma Polymer Coating Treatment

[399] Investigation of Degradation Behaviour of Adhesion between Copper and Molding　Resin for Power Module under High Temperature Environment