日本金属学会2024年秋期(第175回)講演大会

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

9:00 AM - 9:15 AM

[383] Delamination Analysis at the Dielectric Film / Redistribution Layer Interface in Semiconductor Package Structure using Cohesive Zone Model

*Yusei HAMADA1, Yoshiharu KARIYA2 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Semiconductor Package、Dielectric film、Finite Element Method、Cohesive Zone Model、Critical energy release rate

仮想き裂を必要としない結合力モデルを用い,半導体パッケージ再配線層中の絶縁膜 / 再配線界面の剥離発生箇所を推定した.

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