[G] Solid process/ Solid and welding process

[384] Computation of Delamination Toughness of Interlayer Dielectrics / Cu Interface for Semiconductor Pakage Redistribution Layer by Shear Testing

*Kourin YOSHIMOTO¹, Yoshiharu KARIYA², Mitsuka ANDO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Keywords:Critical energy release rate、Delamination、Polymer、Shear test、Finite element method

剥離強度を簡易的に評価出来るシア試験と有限要素法 (FEM) による剥離解析を行い，擬似的に剥離靭性値を算出する方法を検討した．