日本金属学会2024年秋期(第175回)講演大会

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

9:15 AM - 9:30 AM

[384] Computation of Delamination Toughness of Interlayer Dielectrics / Cu Interface for Semiconductor Pakage Redistribution Layer by Shear Testing

*Kourin YOSHIMOTO1, Yoshiharu KARIYA2, Mitsuka ANDO3, Hirokazu ITO3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Keywords:Critical energy release rate、Delamination、Polymer、Shear test、Finite element method

剥離強度を簡易的に評価出来るシア試験と有限要素法 (FEM) による剥離解析を行い,擬似的に剥離靭性値を算出する方法を検討した.

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