Thermal aging dependent nanoscale porous of pressured sinter silver determining heat transfer and strength properties for power electronics

Ha-Young Yu

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

9:45 AM - 10:00 AM

[386] Thermal aging dependent nanoscale porous of pressured sinter silver determining heat transfer and strength properties for power electronics

*Ha-Young Yu¹, YehRi Kim¹, SeungYeon Han¹, Min-Su Kim¹, Dongjin Kim¹ (1. Korea Institute of Industrial Technology)

Keywords:porous silver、sintering、mechanical property、thermal conductivity、aging

Silver (Ag) sintering is used as a die-bonding technology for the next generation of power electronic modules. In this study, time-dependent effects of sintered Ag under pressure were researched.