[G] Solid process/ Solid and welding process

[389] Material Factor on Delamination Driving Force for Interlayer Dielectric Film / Distribution Material Interface in Redistribution Layer of Semiconductor Package

*Daisuke ANDO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Material Factor、Delamination Driving Force、Interlayer Dielectric Film、Redistribution Layer、Semiconductor Package

半導体パッケージ再配線層における絶縁膜 / 配線材料界面の剥離を防止する絶縁膜の材料設計指針を，実験計画法の Box-Behnken 計画に従い取得した. その結果，高ガラス転移温度の絶縁膜を設計する指針を得た.