日本金属学会2024年秋期(第175回)講演大会

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

10:45 AM - 11:00 AM

[389] Material Factor on Delamination Driving Force for Interlayer Dielectric Film / Distribution Material Interface in Redistribution Layer of Semiconductor Package

*Daisuke ANDO1, Yoshiharu KARIYA2 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)

Keywords:Material Factor、Delamination Driving Force、Interlayer Dielectric Film、Redistribution Layer、Semiconductor Package

半導体パッケージ再配線層における絶縁膜 / 配線材料界面の剥離を防止する絶縁膜の材料設計指針を,実験計画法の Box-Behnken 計画に従い取得した. その結果,高ガラス転移温度の絶縁膜を設計する指針を得た.

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