Evaluation of Thermal Fatigue Behavior of Lead-Free Solder Joints for Wafer-Level CSP

Shun Sakagami

Presentation information

一般講演

6.Materials Processing » Solid process/ Solid and welding process

[G] Solid process/ Solid and welding process

Fri. Sep 20, 2024 9:00 AM - 11:45 AM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:Tatsuya Kobayashi, Shinji Fukumoto

11:15 AM - 11:30 AM

[391] Evaluation of Thermal Fatigue Behavior of Lead-Free Solder Joints for Wafer-Level CSP

*Shun Sakagami¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Fumiya Funatomi², Kyohei Ohashi², Ryuki Sakai² (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)

Keywords:Lead-Free Solder、Wafer-Level CSP、Evaluation of Thermal Fatigue Behavior

現在, 熱サイクル試験機ごとの温度プロファイルが熱疲労寿命に及ぼす影響は明確でない. 本研究では, Sn-3.0Ag-0.5Cu (mass%)はんだ接合部の熱疲労寿命に及ぼす熱サイクル負荷条件の影響を調査した．