Evaluation of Solder Joint Properties of Ni-Cu Alloy Plating Films Formed by Electrochemical Methods

Presentation information

一般講演

6.Materials Processing » Materials Processing

[G] Implementation / Mounting / BrazingAdhesion / Bonding/

Fri. Sep 20, 2024 1:00 PM - 3:00 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:(Osaka University), Shinji Fukumoto, (Gunma University), (Osaka University)

1:30 PM - 1:45 PM

*Sota Mori¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, Gunma Univ.)

Keywords:Ni-Cu Alloy、Electroplating、Electrochemical Method、Solder Joint

はんだ層内に生成させたピラー状金属間化合物によって, クラック成長が抑制されることが報告されている. 本研究では, クラック進展の抑制を目的に, 電解Ni-Cu合金めっき膜を生成させ, はんだとの接合性を評価した.

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