Analysis and Evaluation of Adhesive Deterioration between Epoxy Resin and Metal under High Humidity and High Temperature Environments

Ryota Nakagawa

Presentation information

一般講演

6.Materials Processing » Materials Processing

[G] Implementation / Mounting / BrazingAdhesion / Bonding/

Fri. Sep 20, 2024 1:00 PM - 3:00 PM Room P (A302 3rd floor Building A Center for Education in Liberal Arts and Sciences)

Chair:(Osaka University), Shinji Fukumoto, (Gunma University), (Osaka University)

2:00 PM - 2:15 PM

[396] Analysis and Evaluation of Adhesive Deterioration between Epoxy Resin and Metal under High Humidity and High Temperature Environments

*Ryota Nakagawa¹, Ikuo Shohji¹, Tatsuya Kobayashi¹, Fumiya Funatomi², Kyohei Ohashi², Ryuki Sakai² (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)

Keywords:Epoxy Resin、A1050、Adhesion、Thermal Humidity Test、Water Absorption

金属と樹脂界面の接着性に影響を与える因子を明確にすることは重要な研究課題である. 本研究では, 高温高湿環境下での金属とエポキシ樹脂界面の接着性と劣化の関係を分析する手法を開発することを目的とした.