[19a-C10-1~9] 13.4 Interconnection technology

[19a-C10-6] Periodic Strain Undulation around Through Si Vias in Wafer-On-Wafer Structures

^○Noriyuki Taoka¹, Osamu Nakatsuka¹, Yoriko Mizushima^2,3, Hideki Kitada^2,3, Young Suk Kim^3,4, Tomoji Nakamura², Takayuki Ohba^3,4, Shigeaki Zaima¹ (Nagoya Univ.¹, Fujitsu Laboratories Ltd.², Tokyo Institute of Technology³, The Univ. of Tokyo⁴)

Keywords:Si貫通ビア,歪