The 74th JSAP Autumn Meeting,2013

Presentation information

Oral presentation

08. Plasma Electronics » 8.1 Plasma production and control

[19p-C1-1~17] 8.1 Plasma production and control

Thu. Sep 19, 2013 1:30 PM - 6:00 PM C1 (TC3 1F-101)

4:00 PM - 4:15 PM

[19p-C1-10] Numerical Simulation of film thickness distribution for magnetic fields in Reactive Plasma Deposition method by 3D-Hybrid PIC/MCC method

Masaru Miyashita1, Hisashi Kitami1, Toshiyuki Sakemi1, Yasushi Aoki1, Takanori Kato1 (SHI1)

Keywords:反応性プラズマ,ハイブリッドPIC/MCC,プラズマモデリング