Session information

Regular sessions(Poster presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[29p-PB2-1~3] 13.4 Interconnection technology

Fri. Mar 29, 2013 1:30 PM - 3:30 PM PB2 (2nd gymnasium)

Poster Session 13:30〜15:30(PB)

△：Young Scientist Oral Presentation Award Applied
▲：English Presentation
▼：Both Award Applied and English Presentation

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[29p-PB2-1] Improvement of Copper Wettability by High-Vacuum Planer Magnetron Sputtering using Argon Gas with added Oxygen and Nitrogen

^○Masatoshi Itoh¹, Hiroyuki Iida¹, Shigeru Saito¹ (Tokyo Univ. of Science¹)

[29p-PB2-2] Can bio veins be used as interconnects?

^○Eiichi Kondoh¹, Mitsuhiro Watanabe¹, Hirofumi Mochizuki¹, Toshiaki Goto¹ (Univ. Yamanashi¹)

[29p-PB2-3] Size Dependence of the resisitivity of Ni silicide Nanowire formed by 2step annealing process

^○Jinhan Song¹, Kazuki Matsumoto¹, Kuniyuki Kakushima², Ahmet Parhat¹, Yoshinori Kataoka², Akira Nishiyama², Nobuyuki Sugii², Kazuo Tsutsui², Kenji Natori¹, Takeo Hattori¹, Hiroshi Iwai¹ (Tokyo Tech. FRC¹, Tokyo Tech. IGSSE²)

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