[29p-PA1-1~17] 8. Plasma Electronics

[29p-PA1-2] Characteristics of Sputtering Deposition Processing Plasma using Powder Target (8.3)

^○Hiroharu Kawasaki¹, Dasichi Taniyama¹, Tamiko Ohshima¹, Yoshihito Yagyu¹, Takeshi Ihara¹, Yuki Tanaka¹, Yoshiaki Suda¹ (Sasebo Nat'l Col. Tech.¹)

Keywords:Sputtering、Powder