The 60th JSAP Spring Meeting,2013

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Regular sessions(Poster presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[29p-PB2-1~3] 13.4 Interconnection technology

Fri. Mar 29, 2013 1:30 PM - 3:30 PM PB2 (2nd gymnasium)

[29p-PB2-1] Improvement of Copper Wettability by High-Vacuum Planer Magnetron Sputtering using Argon Gas with added Oxygen and Nitrogen

○Masatoshi Itoh1, Hiroyuki Iida1, Shigeru Saito1 (Tokyo Univ. of Science1)

Keywords:Cu配線、sputtering、ruthenium