[29p-PB4-1~25] 15.6 IV-group-based compounds

[29p-PB4-15] Reliability assessment of BiAgX die attachment for SiC power modules

^○Satoshi Tanimoto^1,2, Kinuyo Watanabe¹, Hidekazu Tanisawa^1,3, Kohei Matsui^1,4, Shinji Sato^1,3 (R&D Center, FUPET¹, Nissan Motor², Sanken Electric³, Fuji Electric⁴)

Keywords:SiC、power module、BiAgX