The 60th JSAP Spring Meeting,2013

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Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[30a-G6-1~11] 13.4 Interconnection technology

Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)

[30a-G6-1] In Situ Observation of Copper Dissolution using High-Speed AFM

○Ryosuke Sakamoto1, Masanori Hayase1 (Tokyo University of Science1)

Keywords:AFM