The 60th JSAP Spring Meeting,2013

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Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[30a-G6-1~11] 13.4 Interconnection technology

Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)

[30a-G6-10] △Hydrogen Radical Cleaning for Cu/Polymer Hybrid Wafer Bonding

○Mayu Aoki1, Kazuyuki Hozawa1, Yuko Hanaoka1, Kenichi Takeda1 (Association of Super-Advanced Electronics Technologies1)

Keywords:TSV、三次元実装、ウェハ接合