Adhesion and Nucleation Property of CVD-Cu on ALD-Co(W) Film as Cu Diffusion Barrier Layer

Presentation information

Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)

^○（M2）Kohei Shima¹, Hideharu Shimizu¹, Takeshi Momose¹, Yukihiro Shimogaki¹ (The Univ. of Tokyo¹)

Keywords:Cu-CVD