Highly Reliable Barrier Technology of Cu Wiring by Build-up Method

Presentation information

Regular sessions(Oral presentation)

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

Sat. Mar 30, 2013 9:00 AM - 12:00 PM G6 (B5 1F-2106)

^○Tsuyoshi Kanki¹, Junya Ikeda¹, Shoichi Suda¹, Yasushi Kobayashi¹, Yoshihiro Nakata¹, Tomoji Nakamura¹ (FUJITSU LABORATORIES LTD.¹)

Keywords:再配線、信頼性、Metal-Cap