The 75th JSAP Autumn Meeting, 2014

Presentation information

Poster presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[17p-PA1-1~16] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Sep 17, 2014 1:30 PM - 3:30 PM PA1 (Gymnasium1)

ポスター掲示時間13:30~15:30(PA1会場)

1:30 PM - 3:30 PM

[17p-PA1-5] A Tri-Axis MEMS Accelerometer Using Multi-Layered Metal Structure

Takaaki Matsushima1, Toshifumi Konishi1, Daisuke Yamane2, Hiroshi Toshiyoshi3, Kazuya Masu2, Katsuyuki Machida1,2 (NTT-AT1, Tokyo Inst. of Tech.2, Univ. of Tokyo3)

Keywords:CMOS-MEMS,加速度センサ,積層メタル構造