[18a-A18-1~9] 3.15 Silicon photonics

△ [18a-A18-3] Investigation of Etching Process of III-V Layer toward III-V/SOI Hybrid Devices by using Plasma Activated Bonding

^○Junichi Suzuki¹, Yusuke Hayashi¹, Yuki Kuno¹, JoonHyun Kang¹, Tomohiro Amemiya², Nobuhiko Nishiyama¹, Shigehisa Arai^1,2 (Tokyo Inst. Tech., Dept. Electrical and Electronic Engineering¹, QNERC²)

Keywords:シリコンフォトニクス,ハイブリッド集積,直接接合