The 75th JSAP Autumn Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18a-A19-1~13] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 9:00 AM - 12:30 PM A19 (E311)

11:45 AM - 12:00 PM

[18a-A19-11] Low-Pressure CoC Bonding at Room Temperature by Miniaturization of Compliant Bump

○Yohei Aoki1, Ryo Takigawa1, Keiichiro Iwanabe1, Takanori Shuto1, Tanemasa Asano1 (Kyushu Univ.1)

Keywords:マイクロバンプ,3D積層