The 75th JSAP Autumn Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18a-A19-1~13] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Sep 18, 2014 9:00 AM - 12:30 PM A19 (E311)

10:45 AM - 11:00 AM

[18a-A19-7] Cu bump formation on Al electrodes with electroless neutral Cu plating

○Osamu Sugiura1 (Chiba Inst. of Tech.1)

Keywords:無電解銅めっき,electroless Cu plating