[19a-A15-1~9] 13.1 Basic Properties, Surface and Interface Phenomena, and Simulation

[19a-A15-2] Reduction of nonuniformity caused by wafer guide in ultrasonic cleaning

^○Hiroki Takahashi¹, Masaki Okawa² (Hitachi, Ltd., Yokohama Research Laboratory¹, Kokusai Electric Semiconductor Service Inc.²)

Keywords:洗浄,超音波