[19a-PB2-1~11] 6.4 New thin-film materials

[19a-PB2-1] Diamond Like Carbon Prepared on Silicon Substrate with Ti Buffer Layer

^○Satoru Kaneko^1,8, Takashi Matsunaga², Kaoru Ikenaga³, Takeshi Ito⁶, Manabu Yasui⁷, Takahiro Horiuchi¹, Shigeo Yasuhara⁴, Katsuhiro Mihirogi⁴, Masao Kumagai⁵, Hirofumi Takikawa⁹, Eiji Shimodaira⁵, Masazumi Kobayashi⁶, Rieko Sudo⁷, Akifumi Matsuda⁸, Mamoru Yoshimoto⁸ (Kanagawa Ind. Tech. Center¹, Tech. Res. Inst. Osaka², Jap. Electronics Tech.³, Jap. Adv. Chem.⁴, Fuji WPC⁵, KOBASEI⁶, SIC⁷, Tokyo Inst. of Tech.⁸, Toyohashi Uni. of Tech.⁹)

Keywords:DLC,シリコン,チタン緩衝膜