[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-A19-15] Development of alignment method for ununiform deformed board by reticle free exposure apparatus

^○Mitsunori Tone¹, Satoshi Yokoyama¹, Hiroshi Kubota¹, Masao Yoshioka² (GSST Kumamoto Univ.¹, Kumamoto Univ.²)

Keywords:レチクルフリー,アライメント,FPC