[19p-A19-1~15] 13.3 Si Process・Interconnect・MEMS・Integration

△ [19p-A19-4] Sub-nanoscale Structure and the Barrier Performance of Cu(Mn)/Co(W) System for ULSI Cu Interconnect Proved Using 3D Atom Probe

^○(D)Kohei Shima¹, Tu Yuan², Bin Han², Yu Takamizawa², Hideharu Shimizu¹, Yasuo Shimizu², Takeshi Momose¹, Koji Inoue², Yasuyoshi Nagai², Yukihiro Shimogaki¹ (The Univ. of Tokyo¹, IMR Tohoku Univ.²)

Keywords:Cu interconnect,Atom probe