[17a-PG3-1~15] 15.6 IV族系化合物

▲ [17a-PG3-6] Impact of the atomic-step finishing by CMP on the wettability of SiC substrates

^○Gemma Rius¹, Yuji Hirose¹, Yayoi Tanaka¹, Osamu Eryu¹ (NITech)

キーワード：CMP,Wettability,Electronic devices