[17p-PA2-1~27] 5.0 Optoelectronics (Poster)

[17p-PA2-18] Analysis of Transmission Characteristics between Si chips with Photonic Wire Bonding

^○Zhichen Gu¹, Tomohiro Amemiya², Atsushi Ishikawa³, Junichi Suzuki¹, Eijun Murai¹, JoonHyun Kang¹, Takuo Hiratani¹, Yuki Atsumi², Nobuhiko Nishiyama¹, Takuo Tanaka³, Shigehisa Arai^1,2 (Tokyo Tech E.E¹, QNERC², RIKEN³)

Keywords:Photonic wire bonding